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Pac Tech GmbH equipment offers semiconductor manufacturers several distinct advantages over other conventional methods. There is virtually no damage to substrates using their patented contactless method of applying solder-balls to fine and thin materials such as those used in hard disk drive head applications. The electroless wafer bumping method has a strong advantage in achieving short lead-time and low-cost compared to existing electroplating methods. As semiconductor geometries become smaller and smaller, the need for very fine-pitch solder-ball placement and wafer level packaging will become even more critical.